芯片制造
半导体衬底 —— 芯片制造的核心基石,以超高纯度、优异晶体质量、精密晶格匹配及稳定理化性能,赋能逻辑芯片、存储芯片、功率芯片、先进制程等场景,支撑器件集成与性能突破,保障芯片制造的良率与可靠性,为高端芯片创新筑牢硬核根基。
Semiconductor Substrate – the core cornerstone of chip manufacturing. With ultra-high purity, excellent crystal quality, precise lattice matching, and stable physical-chemical properties, it empowers logical chips, memory chips, power chips, advanced processes, and other scenarios. It supports device integration and performance breakthroughs, ensures the yield and reliability of chip manufacturing, laying a solid core foundation for high-end chip innovation.
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